| PART |
Description |
Maker |
| AN10778 |
PCB layout guidelines for NXP MCUs in BGA packages
|
NXP Semiconductors
|
| AN400 |
Si474X ANTENNA, SCHEMATIC, LAYOUT, AND DESIGN GUIDELINES
|
Silicon Laboratories
|
| SI4835-B31 SI4831-B30 SI4824-A10 SI4820-A10 |
Si483X-B/Si4820/24 ANTENNA, SCHEMATIC, LAYOUT, AND DESIGN GUIDELINES
Si483X-B/Si4820/24 ANTENNA, SCHEMATIC, LAYOUT, AND DESIGN GUIDELINES
|
Silicon Laboratories
|
| AN3206 |
PCB design guidelines for the STM32W108 platform
|
STMicroelectronics
|
| MT6517 |
(MT6515 / MT6517) PCB layout
|
Mediatek
|
| 18101RC MM58274CV |
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Pkg Converter
A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout
|
Aries Electronics, Inc.
|
| Q2686 |
Process Customer Guidelines
|
Wavecom
|
| AN1474 |
ST92F150 AND ST92F120 PROBLEM RESOLUTION GUIDELINES
|
STMicroelectronics
|
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| AN-010 |
Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components
|
M/A-COM Technology Solutions, Inc.
|
